The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7648851 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 19, 2010

Filed:

Mar. 06, 2006
Applicants:

Shih-chu Fu, Taipei, TW;

Gwo-yuh Shiau, Hsinchu, TW;

Liang-lung Yao, Taipei, TW;

Yuan-chih Hsieh, Hsinchu, TW;

Feng-jia Shiu, Hsinchu, TW;

Inventors:

Shih-Chu Fu, Taipei, TW;

Gwo-Yuh Shiau, Hsinchu, TW;

Liang-Lung Yao, Taipei, TW;

Yuan-Chih Hsieh, Hsinchu, TW;

Feng-Jia Shiu, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for fabricating a back-side illuminated image sensor includes providing a semiconductor substrate having a front surface and back surface, providing a plurality of transistors, metal interconnects, and metal pads on front surface of the substrate, bonding a supporting layer to the front surface of the substrate, thinning-down the semiconductor substrate from the back surface, clearing-out a region of the semiconductor substrate from the back surface that covers a fine alignment mark by performing registration from the back surface and using a global alignment mark as a reference, and processing the back surface of the substrate by performing registration from the back surface and using the fine alignment mark as a reference.


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Fu, Shih-Chu. (2010). Method of fabricating backside illuminated image sensor (U.S. Patent No. 7648851). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7648851

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