The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2010

Filed:

Mar. 31, 2006
Applicants:

John M. Boyd, Hillsboro, OR (US);

Fritz C. Redeker, Fremont, CA (US);

Yezdi Dordi, Palo Alto, CA (US);

Michael Ravkin, Sunnyvale, CA (US);

Robert Maraschin, Cupertino, CA (US);

Inventors:

John M. Boyd, Hillsboro, OR (US);

Fritz C. Redeker, Fremont, CA (US);

Yezdi Dordi, Palo Alto, CA (US);

Michael Ravkin, Sunnyvale, CA (US);

Robert Maraschin, Cupertino, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25F 7/00 (2006.01); C25B 9/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

A number of apertures are defined within a wall of a chamber defined to maintain an electrolyte solution. A cation exchange membrane is disposed within the chamber over the number of apertures. The electrolyte solution pressure within the chamber causes the cation exchange membrane to extend through the apertures beyond an outer surface of the chamber. A cathode is disposed within the chamber. The cathode is maintained at a negative bias voltage relative to a top surface of a wafer to be planarized. When the top surface of the wafer is brought into proximity of the cation exchange membrane extending through the apertures, and a deionized water layer is disposed between the top surface of the wafer and the cation exchange membrane, a cathode half-cell is established such that metal cations are liberated from the top surface of the wafer and plated on the cathode in the chamber.


Find Patent Forward Citations

Loading…