The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2010

Filed:

Sep. 21, 2004
Applicants:

Kazushi Higashi, Neyagawa, JP;

Kouichi Yoshida, Kawasaki, JP;

Shinji Ishitani, Akashi, JP;

Daido Komyoji, Ikoma, JP;

Inventors:

Kazushi Higashi, Neyagawa, JP;

Kouichi Yoshida, Kawasaki, JP;

Shinji Ishitani, Akashi, JP;

Daido Komyoji, Ikoma, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a semiconductor device of the present invention, in order that the contact of electrodes formed on a film substrate with edge parts of a semiconductor element at the time such as when the semiconductor element is mounted thereon may be reliably prevented, in the semiconductor element mounted on at least one surface of the film substrate having the electrodes, an insulating protection part is formed at a desired position of the surface opposed to the electrodes, and the distance between the semiconductor element and the film substrate is set at not less than 10 μm.


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