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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7646062 B1

PDFFull Text
Date of Patent:
Jan. 12, 2010

Filed:

Jun. 28, 2007

Semiconductor device comprising buried wiring layer

Applicants:

Yoshikazu Yamaoka, Ogaki, JP;

Satoru Shimada, Hashima, JP;

Inventors:

Yoshikazu Yamaoka, Ogaki, JP;

Satoru Shimada, Hashima, JP;

Assignee:

Sanyo Electric Co., Ltd., Osaka, JP;

Attorney:

Ditthavong, Mori & Steiner, P.C.

Primary Examiner:

Ida M Soward

Int. Cl.
CPC ...
H01L 27/01 (2006.01); H01L 27/12 (2006.01); H01L 27/10 (2006.01); H01L 29/73 (2006.01); H01L 29/74 (2006.01); H01L 27/148 (2006.01); H01L 29/749 (2006.01); H01L 29/768 (2006.01); H01L 29/76 (2006.01); H01L 29/94 (2006.01); H01L 31/062 (2006.01); H01L 31/113 (2006.01); H01L 31/119 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device that suppresses partial discharging to a semiconductor substrate caused by local concentration of current. The semiconductor device includes a semiconductor substrate, a gate electrode buried in the semiconductor substrate, a conductor buried in the semiconductor substrate further inward from the gate electrode, a wiring layer formed in the semiconductor substrate in connection with the conductor, and an insulation film arranged between the gate electrode and the conductor. The conductor is higher than the surface of the semiconductor substrate.

Find Patent Forward Citations

Yamaoka, Yoshikazu. (2010). Semiconductor device comprising buried wiring layer (U.S. Patent No. 7646062). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7646062

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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