The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2010
Filed:
Jun. 30, 2004
Yezdi N. Dordi, Palo Alto, CA (US);
Fred C. Redeker, Fremont, CA (US);
John M. Boyd, Atascadero, CA (US);
Robert Maraschin, Cupertino, CA (US);
Carl Woods, Aptos, CA (US);
Yezdi N. Dordi, Palo Alto, CA (US);
Fred C. Redeker, Fremont, CA (US);
John M. Boyd, Atascadero, CA (US);
Robert Maraschin, Cupertino, CA (US);
Carl Woods, Aptos, CA (US);
Lam Research Corporation, Fremont, CA (US);
Abstract
An electroplating apparatus for electroplating a surface of a wafer is provided. The wafer is capable of being electrically charged as a cathode. The electroplating apparatus includes a plating head capable of being positioned either over or under the surface of a wafer and capable of being electrically charged as an anode. The plating head is capable of enabling metallic plating between the surface of the wafer and the plating head when the wafer and plating head are charged. The plating head further comprises a voltage sensor pair capable of sensing a voltage present between the plating head and the surface of the wafer, and a controller capable of receiving data from the voltage sensor pair. The data received from the voltage sensor pair is used by the controller to maintain a substantially constant voltage to be applied by the anode when the plating head is placed in positions over the surface of the wafer. A method of electroplating a wafer is also provided.