The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2010

Filed:

Nov. 29, 2005
Applicants:

Satoshi Ohkawara, Tokyo, JP;

Kuniharu Izumi, Tokyo, JP;

Shigeru Ishii, Tokyo, JP;

Ryu Komine, Tokyo, JP;

Inventors:

Satoshi Ohkawara, Tokyo, JP;

Kuniharu Izumi, Tokyo, JP;

Shigeru Ishii, Tokyo, JP;

Ryu Komine, Tokyo, JP;

Assignee:

Disco Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

A rectangular substrate dividing apparatus, which can divide a rectangular substrate in a smaller space, accommodate devices, formed as individual pieces by the division, into device cases, and pick up the devices reliably and efficiently from a protective tape affixed to the back of the rectangular substrate, is provided. This apparatus separates a rectangular substrate, to whose back a protective tape is affixed and on which a plurality of devices are partitioned by a lattice of scheduled-separation lines, along the scheduled-separation lines to divide the rectangular substrate into the individual devices, and accommodates the devices in device cases. In a cutting-responsible region, the rectangular substrate is carried out of cassettes, cut by a cutter, and then cleaned by a cleaner. In a tape peeling-responsible region, the devices are picked up with the protective tape being peeled off. In a device accommodation-responsible region, the picked-up individual devices are accommodated into device cases.


Find Patent Forward Citations

Loading…