The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2010
Filed:
Oct. 23, 2007
Takeshi Kuzuhara, Nukata-gun, JP;
Atsushi Komura, Kariya, JP;
Mitsutaka Katada, Hoi-gun, JP;
Takayoshi Naruse, Okazaki, JP;
Takeshi Kuzuhara, Nukata-gun, JP;
Atsushi Komura, Kariya, JP;
Mitsutaka Katada, Hoi-gun, JP;
Takayoshi Naruse, Okazaki, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
A semiconductor device includes a substrate, an element formed in the substrate, an insulation film formed on the substrate, wiring layers, and an electrode pad. The wiring layers are multilayered and electrically coupled to the element through the insulation film. The electrode pad is electrically coupled to a top wiring layer of the wiring layers. The top wiring layer is configured to be a top wiring-electrode layer that doubles as an electrode layer disposed under the electrode pad. The electrode layer of the top wiring-electrode layer is disposed directly above the element. The electrode pad and the electrode layer are multilayered to form a pad structure.