The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2010
Filed:
May. 31, 2007
Applicants:
Joachim Mahler, Regensburg, DE;
Ralf Otremba, Kaufbeuren, DE;
Bernd Betz, Obertraubling/Oberhinkofen, DE;
Khalil Hosseini, Weihmichl, DE;
Inventors:
Joachim Mahler, Regensburg, DE;
Ralf Otremba, Kaufbeuren, DE;
Bernd Betz, Obertraubling/Oberhinkofen, DE;
Khalil Hosseini, Weihmichl, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/14 (2006.01); H01L 23/24 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01); H01L 21/52 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor component includes a semiconductor chip provided with a passivation layer that covers the topmost interconnect structure of the semiconductor chip whilst leaving contact areas free. The passivation layer is in direct adhesive contact with the plastic housing composition of the semiconductor component. The passivation layer includes a polymer with embedded mineral-ceramic nanoparticles.