The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2009
Filed:
May. 10, 2007
Applicants:
Hong Shi, Santa Rosa, CA (US);
Yee Huan Yew, Penang, MY;
Inventors:
Hong Shi, Santa Rosa, CA (US);
Yee Huan Yew, Penang, MY;
Assignee:
Altera Corporation, San Jose, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); G06F 9/45 (2006.01);
U.S. Cl.
CPC ...
Abstract
The embodiments of the present invention provide methods for choosing a via layout pattern(s) for power distribution network in a package for a semiconductor die. The chosen via layout pattern allows the power distribution network to meet the limitation on the loop inductance in order to avoid causing a large ΔV affecting the functionality of semiconductor devices on the die. In addition, the chosen via layout pattern also meets the limitation of total number of vias allowed for the power distribution network in the package.