The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2009
Filed:
Dec. 15, 2006
Masahiro Kojima, Tokyo, JP;
Masakazu Kawahara, Tokyo, JP;
Michiharu Ichikawa, Kanagawa, JP;
Hiroyuki Kado, Kanagawa, JP;
Masahiro Kojima, Tokyo, JP;
Masakazu Kawahara, Tokyo, JP;
Michiharu Ichikawa, Kanagawa, JP;
Hiroyuki Kado, Kanagawa, JP;
DOWA Electronics Materials Co., Ltd., Tokyo, JP;
Central Research Institute of Electric Power Industry, Yokosuka-shi, JP;
Abstract
To provide an oxide superconductor thick film formation method that can enhance adhesiveness of a Bi2223 thick film to a body to be processed on which the Bi2223 thick film is formed, and increase a cross-sectional area of the Bi2223 thick film, without a decrease in Jc of the Bi2223 thick film. A mixture of a compound oxide having composition Bi2212 and Pb is applied to a surface of the body to be processed, and burned to form a first thick film. An oxide superconductor thick film expressed by a general formula (Bi, Pb)SrCaCuO(where −0.1≦a≦0.5) is formed on the first thick film.