The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 22, 2009

Filed:

May. 23, 2000
Applicants:

Chad A. Cobbley, Boise, ID (US);

Michael B. Ball, Boise, ID (US);

Marjorie L. Waddel, Boise, ID (US);

Inventors:

Chad A. Cobbley, Boise, ID (US);

Michael B. Ball, Boise, ID (US);

Marjorie L. Waddel, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/12 (2006.01); B23K 1/00 (2006.01); B23K 35/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

System for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire through-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.


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