The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2009
Filed:
Nov. 15, 2007
Shi-wen Zhou, Shenzhen, CN;
Jun Cao, Shenzhen, CN;
Jie-cheng Deng, Shenzhen, CN;
Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, Guangdong Province, CN;
Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;
Abstract
A heat dissipation device assembly for dissipating heat from a plurality of electronic components mounted on a printed circuit board, includes a heat sink () contacting one of the electronic components, a pair of fans () attached on a lateral side of the heat sink, and a fan duct () fixed on the fans. A plurality of guiding members () are formed inwardly from the fan duct to be located in an interior of the fan duct. The guiding members are used for guiding a screwdriver () to accurately fit with screws () preassembled to the heat sink. Thus, the screws can be quickly and easily fastened by the screwdriver to mount the heat dissipation device assembly on the printed circuit board.