The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2009
Filed:
Nov. 10, 2006
Tadahiko Sakai, Fukuoka, JP;
Tadashi Maeda, Fukuoka, JP;
Mitsuru Ozono, Fukuoka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
In soldering an electronic component, for the purpose of leading molten solder during re-flow, metallic powderis mixed into flux employed so as to intervene between a bump and an electrode. The metallic powderhas a flake or dendrite shape including a core segmentof the metal molten at a higher temperature than the liquid phase temperature of solder constituting a solder bump and a surface segmentof the metal with good-wettability for the molten solder and to be solid-solved in the core segmentmolten. In the heating by the re-flow, the metallic powder remaining in the flux without being taken in a solder portion is molten and solidified to become substantially spherical metallic particlesThus, after the re-flow, the metallic powder does not remain in a flux residue in a state where migration is likely to occur, thereby combining both solder connectivity and insurance of insulation.