The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2009
Filed:
Apr. 16, 2007
Hiroshi Maki, Tokyo, JP;
Masayuki Mochizuki, Tokyo, JP;
Ryuichi Takano, Tokyo, JP;
Yoshiaki Makita, Tokyo, JP;
Haruhiko Fukasawa, Tokyo, JP;
Keisuke Nadamoto, Tokyo, JP;
Tatsuyuki Okubo, Tokyo, JP;
Hiroshi Maki, Tokyo, JP;
Masayuki Mochizuki, Tokyo, JP;
Ryuichi Takano, Tokyo, JP;
Yoshiaki Makita, Tokyo, JP;
Haruhiko Fukasawa, Tokyo, JP;
Keisuke Nadamoto, Tokyo, JP;
Tatsuyuki Okubo, Tokyo, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.