The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2009
Filed:
Sep. 12, 2006
Jan Bex, Overpelt, BE;
Raymond Jacobus Knaapen, Helmond, NL;
Gerard Johannes Pieter Nijsse, Best, NL;
Gerard Kums, Molenstede, BE;
Jan Bex, Overpelt, BE;
Raymond Jacobus Knaapen, Helmond, NL;
Gerard Johannes Pieter Nijsse, Best, NL;
Gerard Kums, Molenstede, BE;
ASML Netherlands B.V., Veldhoven, NL;
Abstract
A method of bonding a MEMS device to a substrate to form a MEMS device assembly. A thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate is determined. An adhesive is deposited onto a mating surface of the MEMS device and/or the mating surface of the substrate. The mating surfaces of the MEMS device and substrate are brought together, such that the adhesive can bond the MEMS device to the substrate. The volume of adhesive deposited at particular locations on the mating surface is varied to compensate for local variations in the thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate.