The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2009
Filed:
May. 02, 2007
Thomas J. Davis, Binghamton, NY (US);
Subahu D. Desai, Vestal, NY (US);
John M. Lauffer, Waverly, NY (US);
James J. Mcnamara, Jr., Vestal, NY (US);
Voya R. Markovich, Endwell, NY (US);
Thomas J. Davis, Binghamton, NY (US);
Subahu D. Desai, Vestal, NY (US);
John M. Lauffer, Waverly, NY (US);
James J. McNamara, Jr., Vestal, NY (US);
Voya R. Markovich, Endwell, NY (US);
Endicott Interconnect Technologies, Inc., Endicott, NY (US);
Abstract
A method of making a multilayered circuitized substrate in which a continuous process is used to form electrically conductive layers which each will form part of a sub-composite. The sub-composites are then aligned such that openings within the conductive layers are also aligned, the sub-composites are then bonded together, and a plurality of holes are then laser drilled through the entire thickness of the bonded structure. The dielectric layers used in the sub-composites do not include continuous or semi-continuous fibers therein, thus expediting hole formation there-through.