The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2009
Filed:
Jun. 21, 2006
Keiichi Kajiyama, Tokyo, JP;
Koichi Kondo, Tokyo, JP;
Yasuomi Kaneuchi, Tokyo, JP;
Disco Corporation, Tokyo, JP;
Abstract
A method of processing a wafer having a device area where a plurality of devices are formed on the front surface and an extra area surrounding the device area and comprising electrodes which are formed in the device area, comprising: a reinforcement forming step for removing an area, which corresponds to the device area, in the back surface of the wafer to reduce the thickness of the device area to a predetermined value and keeping an area, which corresponds to the extra area, in the back surface of the wafer to form an annular reinforcement; and a via-hole forming step for forming a via-hole in the electrodes of the wafer which has been subjected to the reinforcement forming step.