The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2009
Filed:
Dec. 28, 2006
Applicants:
Soshi Kuroda, Tokyo, JP;
Naoya Yasuda, Tokyo, JP;
Hideyuki Arakawa, Tokyo, JP;
Akira Yamazaki, Tokyo, JP;
Koji Bando, Tokyo, JP;
Inventors:
Soshi Kuroda, Tokyo, JP;
Naoya Yasuda, Tokyo, JP;
Hideyuki Arakawa, Tokyo, JP;
Akira Yamazaki, Tokyo, JP;
Koji Bando, Tokyo, JP;
Assignee:
Renesas Technology Corp., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device in which memory chips are stacked on the surface of a wiring substrate has a microcomputer chip and an interposer chip arranged on the surface of the memory chip. The pads of the microcomputer chip and the pads of the interposer chip are arranged almost circularly and are connected by bonding wires.