The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2009
Filed:
Oct. 04, 2005
Applicants:
Katsuyuki Moriya, Toyoshina-machi, JP;
Toshimitsu Hirai, Chino, JP;
Inventors:
Katsuyuki Moriya, Toyoshina-machi, JP;
Toshimitsu Hirai, Chino, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A wiring pattern forming method which is a method of forming a wiring pattern by using a liquid droplet ejection method on a preset area on a substrate, includes:
Moriya, Katsuyuki. (2009). Wiring pattern forming method, film pattern forming method, semiconductor device, electro-optical device, and electronic equipment (U.S. Patent No. 7622385). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7622385
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile