The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2009
Filed:
Dec. 22, 2004
Applicants:
Shinji Takase, Kyoto, JP;
Takashi Tamura, Kyoto, JP;
Yohei Onishi, Kyoto, JP;
Inventors:
Assignee:
Towa Corporation, Kyoto-shi, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 43/18 (2006.01); B29C 70/78 (2006.01); B29C 70/72 (2006.01);
U.S. Cl.
CPC ...
Abstract
An upper mold, a lower mold, a middle mold, and a release film are used in a method of resin sealing of an electronic component. The release film is sandwiched between the lower mold and the middle mold and held under a prescribed tension to cover a cavity of the lower mold. A cavity side surface is also covered with the release film. Therefore, releasability of a cured resin from the cavity side surface is increased. As a result, the cured resin is prevented from being damaged near the cavity side surface.