The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2009
Filed:
May. 06, 2008
Junichiro Osako, Kodaira, JP;
Hirotaka Nishizawa, Fuchu, JP;
Kenji Osawa, Hachioji, JP;
Akira Higuchi, Kodaira, JP;
Junichiro Osako, Kodaira, JP;
Hirotaka Nishizawa, Fuchu, JP;
Kenji Osawa, Hachioji, JP;
Akira Higuchi, Kodaira, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
An IC body is loaded to a casemade of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an external connection terminal at a back surface thereof; a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via a interconnect; and the sealing portion made of thermosetting resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. The present invention makes it possible to heighten the strength of IC cards and at the same time, to reduce the manufacturing cost and improve the reliability.