The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2009
Filed:
Mar. 15, 2007
Applicant:
Shih-cheng Chang, Hsinchu, TW;
Inventor:
Shih-Cheng Chang, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit chip package and a method of manufacture thereof are provided. In one embodiment, the integrated circuit chip package comprises a semiconductor die having power and ground routings, a plurality of through wafer vias disposed within the semiconductor die, the through wafer vias connected to the power and ground routings, and a substrate attached to the semiconductor die, the substrate having power and ground leads connected to the through wafer vias for transferring power from the substrate to the semiconductor die.