The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2009
Filed:
Aug. 28, 2006
Applicants:
Danny Lau, Fanling, HK;
Raymund W. M. Kwok, Kowloon, HK;
Inventors:
Danny Lau, Fanling, HK;
Raymund W. M. Kwok, Kowloon, HK;
Assignee:
Rohm and Haas Electronic Materials LLC, Marlborough, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/50 (2006.01); B05D 3/02 (2006.01); B32B 15/01 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
Abstract
Methods and articles are disclosed. The methods are directed to depositing nickel duplex layers on substrates to inhibit tin and tin alloy surface oxidation and improve solderability of the substrates.
Quick Actions:
Lau, Danny. (2009). Metal duplex method (U.S. Patent No. 7615255). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7615255
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile