The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2009
Filed:
May. 04, 2007
Applicants:
Ka Shing Kenny Kwan, Singapore, SG;
Boon June Yeap, Singapore, SG;
Inventors:
Ka Shing Kenny Kwan, Singapore, SG;
Boon June Yeap, Singapore, SG;
Assignee:
ASM Technology Singapore Pte Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/06 (2006.01); B23K 37/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A bonding apparatus comprising a bond arm and a wire bonding tool mounted to the bond arm is provided with thermal insulation in the form of a thermal shield substantially enclosing the bonding tool for insulating the bonding tool from ambient heat.