The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2009
Filed:
Mar. 03, 2005
Takaki Kuno, Kyoto, JP;
Keiji Maeda, Kyoto, JP;
Yoshinori Noguchi, Kyoto, JP;
Satoshi Kitaoka, Nagoya, JP;
Naoki Kawashima, Nagoya, JP;
Seiichi Suda, Nagoya, JP;
Masato Yoshiya, Nagoya, JP;
Norio Yamaguchi, Nagoya, JP;
Takaki Kuno, Kyoto, JP;
Keiji Maeda, Kyoto, JP;
Yoshinori Noguchi, Kyoto, JP;
Satoshi Kitaoka, Nagoya, JP;
Naoki Kawashima, Nagoya, JP;
Seiichi Suda, Nagoya, JP;
Masato Yoshiya, Nagoya, JP;
Norio Yamaguchi, Nagoya, JP;
Towa Corporation, Kyoto-Shi, Kyoto, JP;
Japan Fine Ceramics Center, Nagoya-Shi, Aichi, JP;
Abstract
A mold surface of an upper mold with which a fluid resin comes into contact has an oxide therein. The oxide contains a metal cation and an ion. Field strength is calculated based on a valence of the metal cation and ionic radius of the ion. Based on predetermined relationship established between a value of the field strength and adhesion strength between a cured resin and the mold surface, releasability between the cured resin and the mold surface is evaluated. Thereby, a method of evaluating releasability between the cured resin and the mold surface is established. With this evaluation method, a material with high releasability can readily be provided. Further, if the material with high releasability is used for the mold surface of the upper mold, a mold for molding a resin having excellent releasability can be obtained.