The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2009
Filed:
Nov. 12, 2004
Gareth G. Hougham, Ossining, NY (US);
Russell A. Budd, North Salem, NY (US);
Punit P. Chiniwalla, New York, NY (US);
Paul W. Coteus, Yorktown Heights, NY (US);
Alphonso P. Lanzetta, Marlboro, NY (US);
Frank R. Libsch, White Plains, NY (US);
Gareth G. Hougham, Ossining, NY (US);
Russell A. Budd, North Salem, NY (US);
Punit P. Chiniwalla, New York, NY (US);
Paul W. Coteus, Yorktown Heights, NY (US);
Alphonso P. Lanzetta, Marlboro, NY (US);
Frank R. Libsch, White Plains, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Integrated optoelectronic chips or collections of chips on a module that have both electrical as well as optical interconnects offer many advantages in speed, power consumption and heat generation. Mixed signal types, however, pose significant packaging challenges. This invention describes a land grid array (LGA) interposer which can simultaneously connect electrical and optical signals from a module to a printed circuit board.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile