The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2009
Filed:
Nov. 22, 2006
Hien P. Dang, Nanuet, NY (US);
Vinod Kamath, Raleigh, NC (US);
Vijayeshwar D. Khanna, Millwood, NY (US);
Gerard Mcvicker, Stormville, NY (US);
Sri M. Sri-jayantha, Ossining, NY (US);
Jung H. Yoon, Poughkeepsie, NY (US);
Hien P. Dang, Nanuet, NY (US);
Vinod Kamath, Raleigh, NC (US);
Vijayeshwar D. Khanna, Millwood, NY (US);
Gerard McVicker, Stormville, NY (US);
Sri M. Sri-Jayantha, Ossining, NY (US);
Jung H. Yoon, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A spring-like cooling structure for an in-line chip module is formed from a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at substantially a one-hundred and eighty degree angle, wherein a length of the structure substantially correlates to a length of the in-line chip module, and a width of the structure is wider than a width of the in-line chip module such that the structure fits over and substantially around the in-line chip module; openings at a left-side, right-side and a bottom of the structure for easily affixing and removing the structure from the in-line chip module; a top part comprising a top surface disposed over a top of the in-line chip module when affixed to the in-line chip module, and comprising an angled surface flaring outward from the in-line chip module, the angled surface positioned directly beneath the top surface; a center horizontal part; a gap between the center horizontal part and the plurality of chips; and a flared bottom area of the structure.