The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2009
Filed:
Sep. 24, 2004
Hiroya Kobayashi, Hamamatsu, JP;
Masaharu Muramatsu, Hamamatsu, JP;
Hiroya Kobayashi, Hamamatsu, JP;
Masaharu Muramatsu, Hamamatsu, JP;
Hamamatsu Photonics K.K., Hamamatsu-shi, Shizuoka, JP;
Abstract
With this semiconductor device, the distortion and cracking of a thinned portion of a semiconductor substrate are prevented to enable high precision focusing with respect to a photodetecting unit and uniformity and stability of high sensitivity of the photodetecting unit to be maintained. A semiconductor devicehas a semiconductor substrate, a wiring substrate, conductive bumps, and a resin. A CCDand a thinned portionare formed on semiconductor substrate. Electrodesof semiconductor substrateare connected via conductive bumpsto electrodesof wiring substrate. Wiring substrateis subject to a wettability processing by which a regionthat surrounds a region opposing thinned portionand regionsthat extend to the outer side from region 26are lowered in the wettability with respect to the resin. Insulating resinfills a gap between outer edgeof thinned portionand wiring substratein order to reinforce the bonding strengths of conductive bumps