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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7612439 B1

PDFFull Text
Date of Patent:
Nov. 03, 2009

Filed:

Dec. 22, 2005

Semiconductor package having improved thermal performance

Applicants:

Xiaotian Zhang, San Jose, CA (US);

Argo Chang, Taipei, TW;

James Lee, Taipei, TW;

Ryan Huang, Taipei, TW;

Kai Liu, Sunnyvale, CA (US);

Ming Sun, Sunnyvale, CA (US);

Inventors:

Xiaotian Zhang, San Jose, CA (US);

Argo Chang, Taipei, TW;

James Lee, Taipei, TW;

Ryan Huang, Taipei, TW;

Kai Liu, Sunnyvale, CA (US);

Ming Sun, Sunnyvale, CA (US);

Assignee:

Alpha and Omega Semiconductor Limited, Hamilton, BM;

Attorneys:

Schein & Cai LLP

Douglas E. MacKenzie

Jingming Cai

Primary Examiner:

Alexander O Williams

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A composite semiconductor package is disclosed. The package includes a lead frame having first and second die bonding pads, the first and second die bonding pads having a large lateral separation therebetween, a first device bonded to the first die bonding pad, a second device bonded to the second die bonding pad, a plurality of first leads coupled to the first die bonding pad, a plurality of second leads coupled to the second die bonding pad, and an encapsulant covering the lead frame, the first and second devices and at least a portion of the first and second pluralities of leads. The package may be a TSSOP-8 composite package having a common drain MOSFET pair and an IC.

Find Patent Forward Citations

Zhang, Xiaotian. (2009). Semiconductor package having improved thermal performance (U.S. Patent No. 7612439). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7612439

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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