The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2009
Filed:
May. 25, 2006
Masaru Takada, Ogaki, JP;
Hisashi Minoura, Ogaki, JP;
Kiyotaka Tsukada, Ogaki, JP;
Hiroyuki Kobayashi, Ogaki, JP;
Mitsuhiro Kondo, Ogaki, JP;
Masaru Takada, Ogaki, JP;
Hisashi Minoura, Ogaki, JP;
Kiyotaka Tsukada, Ogaki, JP;
Hiroyuki Kobayashi, Ogaki, JP;
Mitsuhiro Kondo, Ogaki, JP;
Ibiden Co., Ltd., , JP;
Abstract
In a printed wiring board, an odd number (n) of conductive layers (-) and insulating layers (-) are alternately laminated upon another. The first conductive layer () is constituted as a parts connecting layer and the n-th conductive layer () is constituted as an external connecting layer which is connected to external connecting terminals (). The second to (n−1)-th conductive layers () are constituted as current transmitting layers for transmitting internal currents. The surface of the n-th conductive layer () is coated with the outermost n-th insulating layer () in a state where the external connecting terminals () are exposed on the surface. It is preferable to constitute the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.