The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2009

Filed:

Jun. 28, 2007
Applicants:

Ananda K. Bandyopadhyay, West Linn, OR (US);

Seon-mee Cho, Beaverton, OR (US);

Haiying Fu, West Linn, OR (US);

Easwar Srinivasan, Beaverton, OR (US);

David Mordo, Cupertino, CA (US);

Inventors:

Ananda K. Bandyopadhyay, West Linn, OR (US);

Seon-Mee Cho, Beaverton, OR (US);

Haiying Fu, West Linn, OR (US);

Easwar Srinivasan, Beaverton, OR (US);

David Mordo, Cupertino, CA (US);

Assignee:

Novellus Systems, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D 3/06 (2006.01); B05D 3/02 (2006.01); C23C 16/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods and apparatus for improving mechanical properties of a dielectric film on a substrate are provided. In some embodiments, the dielectric film is a carbon-doped oxide (CDO). The methods involve the use of modulated ultraviolet radiation to increase the mechanical strength while limiting shrinkage and limiting any increases in the dielectric constant of the film. Methods improve film hardness, modulus and cohesive strength, which provide better integration capability and improved performance in the subsequent device fabrication procedures such as chemical mechanical polishing (CMP) and packaging.


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