The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2009
Filed:
Apr. 27, 2005
Masaki Tsujimoto, Tokyo, JP;
Takahisa Yoshioka, Tokyo, JP;
Kenji Kobayashi, Tokyo, JP;
Lintec Corporation, Tokyo, JP;
Abstract
A sticking apparatusincludes a sticking tablesupporting a semiconductor wafer W and a sticking unitsticking a heat sensitive adhesive sheet S to the semiconductor wafer W. The sticking unitincludes a peeling section that, when paying out a raw sheet L having adhesive sheet S laminated to one side face of a release liner PS, peels off the release liner PS and the adhesive sheet S and a sheet preliminary peeling unitprovided at an upstream side of the peeling section in a pay-out direction of the raw sheet. The sheet preliminary peeling unitincludes a moving memberthat moves to and from in a state of being pinched between the release liner PS and the adhesive sheet S. The preliminarily peeled-off release liner PS and adhesive sheet S are temporarily re-bonded by a temporary re-bonding unitenabling to stick the adhesive sheet S on the wafer W.