The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2009

Filed:

Nov. 08, 2006
Applicants:

Jun Cao, Shenzhen, CN;

Zhan Wu, Shenzhen, CN;

Shi-wen Zhou, Shenzhen, CN;

Inventors:

Jun Cao, Shenzhen, CN;

Zhan Wu, Shenzhen, CN;

Shi-Wen Zhou, Shenzhen, CN;

Assignees:

Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, Guangdong Province, CN;

Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/427 (2006.01); F28D 15/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat dissipation device includes a first base plate (), a fin group () arranged on the first base plate, a first heat pipe () attached on the first base plate and the fin group and a second heat pipe () attached on the first base plate and extending across the fin group. Each of the first and second heat pipes includes an absorbing section and a dissipating section. The absorbing sections of the first and second heat pipes are L-shaped and oriented in opposite directions and dissipating sections of the first and second heat pipes are oriented perpendicular to each other, whereby heat from the first base plate attached with an electronic component can take more different dissipating-paths from the first base plate to the fin group.


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