The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2009

Filed:

Oct. 19, 2006
Applicants:

Chung-kuan Ting, Taipei County, TW;

Shih-chi Chen, Miaoli County, TW;

Wen-yuan Chang, Hsinchu, TW;

Chia-chung Wu, Hsinchu County, TW;

Inventors:

Chung-Kuan Ting, Taipei County, TW;

Shih-Chi Chen, Miaoli County, TW;

Wen-Yuan Chang, Hsinchu, TW;

Chia-Chung Wu, Hsinchu County, TW;

Assignee:

AU Optronics Corp., Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

A package structure for packaging a panel module. The panel module comprises at least a gap. The package structure comprises a base and a cover. The base comprises a first loading surface for loading the panel module and at least one first engaging portion corresponding to the gap. The cover comprises a first covering surface and a second engaging portion corresponding to the first engaging portion. The first engaging portion and the second engaging portion connect the first loading surface and the first covering surface.


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