The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2009
Filed:
May. 20, 2005
Applicants:
Kaori Shirato, Yokkaichi, JP;
Atsushi Shiota, Ushiku, JP;
Masahiro Tada, Fujisawa, JP;
Sumitoshi Asakuma, Setagaya-ku, JP;
Inventors:
Kaori Shirato, Yokkaichi, JP;
Atsushi Shiota, Ushiku, JP;
Masahiro Tada, Fujisawa, JP;
Sumitoshi Asakuma, Setagaya-ku, JP;
Assignees:
JSR Corporation, Tokyo, JP;
Sumitomo Bakelite Co., Ltd., Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract
A laminate includes a copper wiring layer () provided over a semiconductor layer and having a specific pattern, a protective layer () formed of a polybenzoxazole resin layer provided on the copper wiring layer (), and an insulating layer () provided on the protective layer.