The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2009
Filed:
Mar. 09, 2007
Takatoshi Masuda, Tokyo, JP;
Takatoshi Masuda, Tokyo, JP;
Disco Corporation, Tokyo, JP;
Abstract
A method for producing a semiconductor package including a main semiconductor chip having a semiconductor circuit formed on one surface thereof, at least one subsidiary semiconductor chip stacked on the other surface of the main semiconductor chip, and an encapsulation resin covering the subsidiary semiconductor chip. This method comprises a semiconductor wafer preparation step of preparing a semiconductor wafer, on whose one surface many rectangular regions are defined by streets, and in each of the rectangular regions of which a semiconductor circuit constituting the main semiconductor chip is disposed; a circular concavity formation step of forming a circular concavity in the other surface of the semiconductor wafer; a semiconductor chip stacking step of stacking at least one such subsidiary semiconductor chip on each of many rectangular regions on the bottom surface of the circular concavity; an encapsulation resin formation step of filling a molten resin into the circular concavity, and curing the resin, thereby forming an encapsulation resin covering the subsidiary semiconductor chips; and a separation step of cutting the encapsulation resin, together with the semiconductor wafer, along the streets, to separate the semiconductor wafer and the encapsulation resin into many of the semiconductor packages.