The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7606036 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 20, 2009

Filed:

May. 25, 2006
Applicants:

Ching-bai Hwang, Tu-Cheng, TW;

Jin-gong Meng, Shenzhen, CN;

Inventors:

Ching-Bai Hwang, Tu-Cheng, TW;

Jin-Gong Meng, Shenzhen, CN;

Assignees:

Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, Guangdong Province, CN;

Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/34 (2006.01); F28D 15/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat dissipation device includes a thermal attach block (), a heat pipe () thermally attached to the block, and a fin unit () thermally attached to the heat pipe. The block includes a curve-shaped bottom surface () allowing it to be thermally attached to a heat generating component () to absorb heat therefrom, and a top surface () opposite to the bottom surface. The heat pipe includes an evaporating section () at one end and a condensing section () at the other. The evaporating section can be thermally attached to the top surface of the block. The condensing section can be thermally attached to the fin unit.


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