The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2009
Filed:
Oct. 15, 2007
Marco Francesco Aimi, Niskayuna, NY (US);
Christopher James Kapusta, Delanson, NY (US);
Arun Virupaksha Gowda, Niskayuna, NY (US);
David Cecil Hays, Niskayuna, NY (US);
Oliver Charles Boomhower, Waterford, NY (US);
Glenn Scott Claydon, Wynantskill, NY (US);
Joseph Alfred Iannotti, Glenville, NY (US);
Christopher Fred Keimel, Schenectady, NY (US);
Marco Francesco Aimi, Niskayuna, NY (US);
Christopher James Kapusta, Delanson, NY (US);
Arun Virupaksha Gowda, Niskayuna, NY (US);
David Cecil Hays, Niskayuna, NY (US);
Oliver Charles Boomhower, Waterford, NY (US);
Glenn Scott Claydon, Wynantskill, NY (US);
Joseph Alfred Iannotti, Glenville, NY (US);
Christopher Fred Keimel, Schenectady, NY (US);
General Electric Company, Niskayuna, NY (US);
Abstract
Multiple microelectromechanical systems (MEMS) on a substrate are capped with a cover using a layer that may function as a bonding agent, separation layer, and hermetic seal. A substrate has a first side with multiple MEMS devices. A cover is formed with through-holes for vias, and with standoff posts for layer registration and separation. An adhesive sheet is patterned with cutouts for the MEMS devices, vias, and standoff posts. The adhesive sheet is tacked to the cover, then placed on the MEMS substrate and heated to bond the layers. The via holes may be metalized with leads for circuit board connection. The MEMS units may be diced from the substrate after sealing, thus protecting them from contaminants.