The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2009
Filed:
Sep. 24, 2004
Hiroya Kobayashi, Hamamatsu, JP;
Masaharu Muramatsu, Hamamatsu, JP;
Hiroya Kobayashi, Hamamatsu, JP;
Masaharu Muramatsu, Hamamatsu, JP;
Hamamatsu Photonics K.K., Hamamatsu-shi, Shizuoka, JP;
Abstract
With this semiconductor device, the distortion and cracking of a thinned portion of a semiconductor substrate are prevented to enable high precision focusing with respect to a photodetecting unit and uniformity and stability of high sensitivity of the photodetecting unit to be maintained. A semiconductor devicehas a semiconductor substratea wiring substrateconductive bumpsand a resinA CCDand a thinned portionare formed on semiconductor substrateElectrodesof semiconductor substrateare connected via conductive bumpsto electrodesof wiring substrateWiring substratehas formed therein a groove portionthat surrounds a region opposing thinned portionand groove portionsthat extend to an exposed surface of wiring substratefrom groove portion. Insulating resinfills a gap between outer edgeof thinned portionand wiring substrateto reinforce the bonding strengths of conductive bumps