The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2009

Filed:

Jan. 31, 2007
Applicants:

Kyu Dong Jung, Yongin-si, KR;

Woon Bae Kim, Yongin-si, KR;

Min Seog Choi, Yongin-si, KR;

Seung Wan Lee, Yongin-si, KR;

Inventors:

Kyu Dong Jung, Yongin-si, KR;

Woon Bae Kim, Yongin-si, KR;

Min Seog Choi, Yongin-si, KR;

Seung Wan Lee, Yongin-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/22 (2006.01); H01L 29/227 (2006.01); H01L 33/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An image pickup device includes a sensor substrate having image sensors arranged in its image pickup region in the form of a matrix. An interlayer insulating film layer is formed below a bottom of the sensor substrate. The interlayer insulating film layer includes wiring layers to construct an electric circuit. The wiring layer is electrically connected with the image sensors. A support substrate is attached on a bottom of the interlayer insulating film layer. The support substrate has contact electrodes formed in via holes. A lens layer is formed over the top surface of the sensor substrate to be opposite to the interlayer insulating film layer. A light-transmitting member is formed over the lens layer.


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