The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2009
Filed:
Sep. 18, 2006
Kazuo Tomita, Tokyo, JP;
Keiji Hashimoto, Tokyo, JP;
Yasutaka Nishioka, Tokyo, JP;
Susumu Matsumoto, Osaka, JP;
Mitsuru Sekiguchi, Shiga, JP;
Akihisa Iwasaki, Osaka, JP;
Kazuo Tomita, Tokyo, JP;
Keiji Hashimoto, Tokyo, JP;
Yasutaka Nishioka, Tokyo, JP;
Susumu Matsumoto, Osaka, JP;
Mitsuru Sekiguchi, Shiga, JP;
Akihisa Iwasaki, Osaka, JP;
Renesas Technology Corp., Tokyo, JP;
Panasonic Corporation, Osaka, JP;
Abstract
First wirings and first dummy wirings are formed in a p-SiOC film formed on a substrate. A p-SiOC film is formed, and a cap film is formed on the p-SiOC film. A dual damascene wiring, including vias connected to the first wirings and the second wirings, is formed in the cap film and the p-SiOC film. Dummy vias are formed on the periphery of isolated vias.