The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2009
Filed:
Apr. 05, 2007
Kazunori Inoue, Kawasaki, JP;
Takashi Matsuda, Kawasaki, JP;
Shogo Inoue, Kawasaki, JP;
Xiaoyu MI, Kawasaki, JP;
Jyouji Kimura, Yokohama, JP;
Kazunori Inoue, Kawasaki, JP;
Takashi Matsuda, Kawasaki, JP;
Shogo Inoue, Kawasaki, JP;
Xiaoyu Mi, Kawasaki, JP;
Jyouji Kimura, Yokohama, JP;
Fujitsu Media Devices Limited, Yokohama, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
An elastic wave device formed by bonding at least two surface acoustic wave devices by filling a resin therebetween is disclosed. Each of surface acoustic wave (SAW) devices includes a substrate; a functioning portion configured on the substrate; a recess that forms a space portion necessary for operation of the functioning portion, and a package that covers the surface of the substrate, and side faces of the package of the at least two SAW devices, corresponding to a portion bonded by filling of the resin between at least two SAW devices, includes the at least one cutout, and a first resin covers a portion of each of the side faces, the back faces, and the front faces of the substrate of the at least two SAW devices, and the first resin is filled with in the at least one cutout on the side faces of the package.