The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2009
Filed:
Jun. 14, 2006
Richard Zhao, Portland, OR (US);
Chris Mozak, Beaverton, OR (US);
Richard Zhao, Portland, OR (US);
Chris Mozak, Beaverton, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An on-die termination method to support a multi-chip package routing topology is described. The on die termination method may increase the surface area on the substrate such that larger size die or more memory may be mounted thereto. The on-die termination method may include a semiconductor package that features on die termination bumps coupled to a semiconductor die's bus terminals, which couples the semiconductor die to an on-die termination pin coupled in the motherboard. An alternative on-die termination method includes a semiconductor die, within the multi-chip CPU package, designated as an end agent from which a single on die termination bump is coupled to an on-die termination pin.