The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2009
Filed:
Sep. 29, 2006
Applicant:
Chi-won Hwang, Tsukuba, JP;
Inventor:
Chi-won Hwang, Tsukuba, JP;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); B23K 35/12 (2006.01); B23K 31/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of making a carbon nanotube reinforced solder cap. Carbon nanotube-solder (CNT-S) particles are transferred from a transfer substrate, having an adhesive layer, to a solder bump by using thermo compression bonding. The CNT-S particles are then reflowed to form a cap on the solder bump. The solder bump with the reflowed cap can then be joined to a bonding pad or another solder bump with a cap by placing the solder bump on the pad or other bump and reflowing at a temperature sufficient to reflow the cap(s).