The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2009
Filed:
Apr. 18, 2007
Yuji Kunimoto, Nagano, JP;
Atsunori Kajiki, Nagano, JP;
Yuji Kunimoto, Nagano, JP;
Atsunori Kajiki, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano-shi, JP;
Abstract
There is provided a mounting substrate on which a semiconductor chip is mounted using a flip chip bonding, having a plurality of connection pads which are connected to the semiconductor chip, and an insulation layer formed in such a manner as to cover the connection pads partially, wherein the insulation layer includes a first insulation layer which is formed in such a manner as to correspond to a center of the semiconductor chip and a second insulation layer which is formed in such a manner as to surround the first insulation layer, and wherein the plurality of connection pads include first connection pads which are partially covered by the first insulation layer and second connection pads which are partially covered by the second insulation layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile