The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2009

Filed:

Jul. 20, 2006
Applicants:

Tseng-hsiang HU, Tu-Cheng, TW;

Yeu-lih Lin, Tu-Cheng, TW;

Li-kuang Tan, Tu-Cheng, TW;

Inventors:

Tseng-Hsiang Hu, Tu-Cheng, TW;

Yeu-Lih Lin, Tu-Cheng, TW;

Li-Kuang Tan, Tu-Cheng, TW;

Assignee:

Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/22 (2006.01); H01L 33/00 (2006.01); H01L 29/227 (2006.01); H01L 23/495 (2006.01); H01L 23/10 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

An LED assembly includes a packaged LED module () and a heat dissipation device (). The LED module includes at least an LED die therein and a plurality of conductive pins () extending downwardly from a bottom portion thereof. The heat dissipation device is thermally and electrically connected with the at least an LED die. The heat dissipation device defines at least a mounting hole () therein. At least one of the conductive pins is fittingly received in the at least a mounting hole and thermally and electrically connects with the heat dissipation device.


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