The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2009

Filed:

Mar. 15, 2007
Applicants:

John Chow, Saratoga, CA (US);

Huan Chen, Kunshan, CN;

Chih-min Lin, Tu-Cheng, TW;

Inventors:

John Chow, Saratoga, CA (US);

Huan Chen, Kunshan, CN;

Chih-Min Lin, Tu-Cheng, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/12 (2006.01); H05K 3/42 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for soldering a soft wire to a printed circuit board conveniently includes the following step: providing a bracket having a through hole and an enameled wire; fastening the enameled wire to the bracket with the conductive wire crossing over the through hole; providing a printed circuit board formed with conductive pads thereon and setting the printed circuit board onto the bracket with the pad aligned to the through hole so that a portion of the magnet wire crossing the through hole lies on the conductive pad; providing a soldering tool having a thermal contact portion and inserting the thermal contact portion into the through hole to solder the magnet wire to the conductive pad.


Find Patent Forward Citations

Chow, John. (2009). Stacked module connector (U.S. Patent No. 7596864). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7596864

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…