The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2009
Filed:
Oct. 27, 2005
Masaru Takada, Ogaki, JP;
Hiroyuki Kobayashi, Ogaki, JP;
Kenji Chihara, Ogaki, JP;
Hisashi Minoura, Ogaki, JP;
Kiyotaka Tsukada, Ogaki, JP;
Mitsuhiro Kondo, Ogaki, JP;
Masaru Takada, Ogaki, JP;
Hiroyuki Kobayashi, Ogaki, JP;
Kenji Chihara, Ogaki, JP;
Hisashi Minoura, Ogaki, JP;
Kiyotaka Tsukada, Ogaki, JP;
Mitsuhiro Kondo, Ogaki, JP;
IBIDEN Co., Ltd., Ogaki-shi, JP;
Abstract
A solder resist comprising a thermosetting resin is printed on a surface of an insulating board () having a conductor circuit (). The solder resist is then heat-cured to form an insulating film () having a low thermal expansion coefficient. A laser beam () is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (), whereby the conductor circuit () is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.