The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2009
Filed:
Oct. 18, 2006
Michael Bauer, Nittendorf, DE;
Ludwig Heitzer, Regensburg, DE;
Jens Pohl, Bernhardswald, DE;
Peter Strobel, Regensburg, DE;
Christian Stuempfl, Schwandorf, DE;
Michael Bauer, Nittendorf, DE;
Ludwig Heitzer, Regensburg, DE;
Jens Pohl, Bernhardswald, DE;
Peter Strobel, Regensburg, DE;
Christian Stuempfl, Schwandorf, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A structure of joining material is applied to the back surfaces of semiconductor chips in manufacturing semiconductor devices. The joining material is applied, in finely metered and structured form via a joining material jet appliance, to the back surfaces of the semiconductor chips of a divided semiconductor wafer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile