The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2009
Filed:
Jul. 25, 2006
Applicant:
Tetsuro Nishimura, Osaka, JP;
Inventor:
Tetsuro Nishimura, Osaka, JP;
Assignee:
Nihon Superior Sha Co., Ltd., , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22B 9/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
The purpose of the present invention is to separate excess coppers leached out in a lead-free solder bath and recover tin with high efficiency. An element X for forming a (CuX)Sncompound between copper and tin in molten lead-free solders is added to separate out a (CuX)Sncompound. Tin is recovered by binding the (CuX)Sncompound by passing thereof through a multi-perforated plate, further generating swirling currents to precipitate and separate the bound (CuX)Sncompounds and removing thereof.
Quick Actions:
Nishimura, Tetsuro. (2009). [object object] (U.S. Patent No. 7591873). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7591873
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